SURFACE MOUNT ASSEMBLY

Chemigraphic’s success as a leading Sub-Contract PCB manufacturer allows us to continually re-invest in some of the most advanced surface mount equipment. Our latest machines push our production capability in excess of 50,000 CPH.

Spread across 2 lines, Chemigraphic have machines that offer maximum speed and flexibility to provide manufacturing solutions to any customer requirement. High volume or low volume, simple or complex, we can offer services for all.

We are also able to offer either RoHS or non-RoHS compliant production with immediate effect. We have carried out extensive trials and made significant investment to develop a robust lead-free manufacturing process.

Our Surface Mount lines consist of the following:

Line 1

• MPM Accuflex Screen Printer
  • Large board width range for maximum flexibility
• JUKI FX1R
  • Chipshooter utilizing two quadruple heads with multi-laser alignment
  • Placement rate of 27,400 cph (IPC 9850)
  • Component size from 0201
• JUKI KE2060
  • Quadruple head with multi-nozzle laser alignment. 1 high-precision placement head with vision and laser alignment.
  • Placement rate of 12,500 cph (IPC 9850)
  • Component size from 0201
• TR6N Matrix tray changer
  • Dual head-shuttle system for fast dispensing of tray components.
  • 20 tray capacity.
• Heller 1707EXL - 7 Zone Reflow Oven
  • New, enlarged heating tunnels and baffle-free design for 25% higher airflow, enhanced temperature uniformity, repeatability and high-load handling.
  • Module response of less than one second to temperature changes of less than 0.1oC, thereby maintaining profile integrity for heavy board loads.
  • PCB width from 95mm up to 360mm.
  • Lead-Free ready.
• Omron VT RNS - Inline AOI
  • Unique patented 3 color RGB inspection system gives 3D data from a 2D image.
  • Uses a fast, 10 micron resolution (01005) system for multi application inspection including component verification and solder joint quality.
  • Situated in-line for immediate post reflow inspection.

Line 2

• DEK Horizon Screen Printer
  • 2D inspection for paste coverage and shorts
  • Formflex tooling
• Contax 3z-80
  • Placement rate of 13,000 cph
  • Components are vision centred via their leads, not their bodies.
  • Component size from 0201
• Contax 3Av-80
  • Placement rate of 9,000 cph
  • Components are vision centred via their leads, not their bodies.
  • Front strobe lighting for BGA placement.
  • Component size from 0402 to 50mm Square.
• Heller 1500EXL - 5 Zone Reflow Oven
  • Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading
  • Enhanced temperature uniformity, repeatability and high-load handling
  • Lead-Free ready.
• Mariantz MCF 22x - Offline AOI
  • Speed 100.000 components/hour
  • SMT & THT Components (missing, type, polarity etc)
  • Solder Joints (lack of solder)
    

We also have the expertise and equipment to rework and re-ball BGA's if necessary.